In recent years, computer chip performance has bumped up against the physical limitations of the space available on integrated circuits.

Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the plumbing that feeds them data. A new generation of 3D chips, built by stacking logic and memory directly on top of each other, is now ...

As traditional chip miniaturization slows, researchers have found a way to pack more computing power into the same space by stacking silicon circuits in multiple layers. The new process uses ultra-thin silicon membranes and low-temperature manufacturing ...

Researchers at Stanford, MIT, and other universities unveiled a new, monolithic 3D processor that could help solve one of the biggest problems facing chipmakers: the processor-memory performance gap. Working with a commercial foundry, the researchers say ...

ALBANY - Dating back to the 1960s, the computer chip industry has been really good at shrinking the size of transistors and other features on chips, a winning formula that drove down the cost of manufacturing while increasing chip performance over time.

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