Advanced assemblies have enabled an unprecedented rate of advancement in the data center, especially for neural processing, ...

3D IC architectures make this possible in part by pushing Moore ... This allows for the creation of more powerful and complex chips that can be used in a wider range of applications. There are several ...

Multi-die integration —in which many chip dies are stacked and integrated in a single package ... technologies into solutions addressing different market segments or needs. 3DIC Compiler is a complete ...

Aug. 25, 2020 -- Synopsys, Inc. (Nasdaq: SNPS) today announced that Synopsys and TSMC have collaborated to deliver certified design flows for advanced packaging solutions using the Synopsys 3DIC ...