400 components, including chipsets and memory, squeezed into a single 2.5 inches x 2.5 inches module "Aiming for mass production in the second half of 2025 and facilitating efforts to build a solid ...
LAS VEGAS--(BUSINESS WIRE)--Quectel Wireless Solutions, an end-to-end global IoT solutions provider, announced the official launch of its new-generation flagship smart module, the SP895BD-AP. Powered ...
LG Innotek announced on the 19th that it is aggressively entering the automotive components market with its new vehicle application processor (AP) module. This means expanding its existing automotive ...
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LG Innotek to launch AP module production in 2025
LG Innotek Company, an electronic component manufacturer belonging to South Korea’s LG Group, announced that it plans to ...
Surging demand for automotive semiconductor components for ADAS and digital cockpits in the era of connected cars 400 components, including chipsets and memory, squeezed into a single 2.5 inches x 2.5 ...
A company official confirmed: “We plan to launch mass produce in the second half of this year. We have already held meetings with global semiconductor companies in North America to market our products ...
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