In recent years, the issue of trustworthiness in electronics has become increasingly important, especially in areas where security is of the essence such as the automotive sector, industry, and ...

Continued innovation in advanced packaging opens a clearer path to the outcomes the industry prioritizes. By tightening the physical distance between compute, memory, and interconnect, chipmakers ...

Purdue University will recognize the impact of alumnus and semiconductor pioneer John Atalla with the naming of the newest system integration and packaging research institute on campus. The Atalla ...

CEO William John Miller reported, "Veeco delivered strong financial performance, exceeding the high end of our guidance. Revenue totaled $166 million, non-GAAP operating income of $23 million and ...

CEO Bill Miller highlighted 2024 as a successful year with milestones such as shipping an LSA system for 2-nanometer gate all-around logic chips and an agreement to ship an LSA evaluation to a second ...

SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...

In recent years, advanced packaging has become much more important. While semiconductor manufacturers used to focus primarily on miniaturization and increasing the performance of individual chips, the ...

Advanced packaging mechanisms play a vital role in reducing food waste and ensuring the maintenance of quality during storage. An incredible challenge faced by the food industry is the development of ...

The field of electronics, particularly integrated circuit (IC) technology, has advanced rapidly in recent years. With the development of 5G/6G mobile technology, semiconductor devices are evolving to ...