Experienced high-speed PCB design and layout engineering is a major requirement for correctly partitioning a BGA on a PCB. Ideally, this expertise should be inextricably intertwined among chip vendors ...

Thanks to new production techniques, a dc-dc converter IC die and multiple components integrate into a more space-efficient power-management module. Semiconductor manufacturers have developed ...

Editor's note: This article addresses the need for designers of printed circuit boards for nextgen ICs to be savvy about package-on-package technology. New ways of working with sub-assembly printed ...

The issue arises when fabricators drill a plated through-hole (PTH) and deposit copper during plating. The remaining diameter after this process becomes the finished hole size. A 4-mil FHS with a ...

Supporting 27 mm x 27 mm, 1-mm pitch BGA packages on any PCB without significant performance loss, the SG-BGA-6346 operates at bandwidths up to 8 GHz with less than 1 dB of insertion loss. Supporting ...

This application note focuses on printed circuit board (PCB) layout considerations for QFN and DQFN packages. This is intended for users who are familiar with PCB design, as well as, signal integrity ...

Recently, we stumbled upon a video by [iBoff], adding an M.2 NVMe port to a 2011-2013 MacBook. Apple laptops never came with proper M.2 ports, especially the A1278 – so what’s up? The trick is – ...

PEMTRON announces its participation at the TPCA Show where it will highlight two of its most advanced inspection solutions.