Tessera Inc. Friday will unveil a new ultra-thin tri-fold stacked chip-scale package (CSP) co-developed with Intel Corp. for that firm's highest-density flash memory. Bruce McWilliams, president and ...
Research and Markets has announced the addition of the "SamsungLM101AChip Scale Package LED: Technology Analysis" report to their offering. The LM101A is the first LED family from Samsung in chip ...
A fully qualified, high-performance, low-power and small-form-factor wafer-level chip-scale package (W-CSP) developed by Oki Semiconductor satisfies a wide range of ASIC design demands. Targeting chip ...
Sunnyvale, Calif.-based Actel Corp. today released a new type of chip-scale package for its eX family of field programmable gate arrays (FPGAs) use in portable devices. According to Actel, the package ...
SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, announced today that it has introduced “Fx-CSP,” a line-up of LED packages which ...
Staccato Communications says its Ripcord wafer chip-scale package offers the smallest form factor of any Certified Wireless USB-based solution available, reducing the space needed to implement an ...
Nowhere is this transformation more visible than at Nvidia, whose valuation recently soared to about $5 trillion, making it ...
Packaging houses are readying their next-generation advanced IC packages, paving the way toward new and innovative system-level chip designs. It’s a confusing landscape with a plethora of buzzwords ...
SANTA CLARA, Calif., Sept. 5, 2017 /PRNewswire/ -- AnaGlobe Technology, Inc., a leader in layout integration solutions, will announce a unified chip-package layout solution, with features and extended ...
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