Ironwood Electronics has released a spring pin socket for BGA500 devices intended for 23 x 23 mm packages with 0.5 mm pitch.

High-frequency center-probe and CSP/MicroBGA test and burn-in sockets are offered in sizes to 6.5-mm2 with pitches down to 0.3 mm to meet the growing need for testing smaller components. The sockets ...

Advanced AI/CPU processors demand extreme high frequency and power performance from SLT and ATE test sockets. These sockets are in the critical path at the end of a very costly silicon fabrication and ...

For the first time, applications that require high-temperature device testing and burn-in, as well as those with high-frequency bandwidth, low inductance and high current conditions, can now ...

A technical paper titled “Fabrication and Characterization of Three-Dimensional Microelectromechanical System Coaxial Socket Device for Semiconductor Package Testing” was published by researchers at ...