Amkor Technology Inc. today said it is the first to qualify a family of two-die stacked chip scale packages (S-CSP) that meet 1.0mm low profile requirements for size and weight reduction in next ...

Various techniques for embedding 3D packaging to boost power density. Different methods for cooling chips using 3D packaging. New and emerging technologies for 3D packaging are being deployed at the ...

Manufacturing-aware system design treats dies, interposers, packages, and analysis as a single, coherent system.

The company held its Samsung Foundry Forum 2024 in San Jose, California, and teased its new 3D packaging technology for HBM chips in a public event, with current-gen HBM memory chips packaged mostly ...

When it comes to making though-silicon vias, there are no clear lines of delineation about the roles of design houses, fab facilities, and packaging houses. Yet all of these entities face a host of ...

If you are familiar with Moore’s Law, you’ve probably read pronouncements that the premise of transistor counts doubling each year is reaching a wall due to complex process technologies and device ...

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...