SIAM Journal on Numerical Analysis, Vol. 28, No. 4 (Aug., 1991), pp. 1004-1014 (11 pages) In this work a finite element method is introduced for the Mindlin-Reissner model that describes the ...
In 2001, IBM patented a method of using a double bump material structure to make a reliable joint between a chip and its package for bump pitch below 150 µm. 1 This invention improved the existing ...
A finite element model for progressive in-plane damage and interfacial delamination was presented for cross-ply composite laminates. The commercial finite element software ABAQUS/STANDARD was used for ...
Parametric features are becoming more common in FEA packages. The key benefit of parametric features is that they let users see the effects of design changes quickly. With adequate planning, users can ...
What Are FEM, FDM and FVM? FEM, FDM and FVM differ from one another in important ways. Understanding these distinctions is key to selecting the method most appropriate for your purposes. The ...
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