CHANDLER, Arizona — Amkor has started using proprietary processes to create both lidded and fully molded cards in the MultiMedia and SecureDigital card (MMC/SDC) formats using a lead-frame packaging ...
Lead frame surface oxidation can lead to surface delamination after molding or wire bonding issues. The application of plasma treatment has been proven to be safe and effective solution to address ...
Innovative IC substrate manufacturer Phoenix Pioneer Technology is undergoing a strategic transformation into advanced packaging. The company is developing cutting-edge xQFN lead frames and fan-out ...
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