Figure 1. A model INL 8 layer metal network assembled from M1, M2, and M4 layers from a 32nm CMOS logic circuit. The INL is fabricated on a Si substrate by 32nm capable BEOL tool sets. The total ...
Unlike the traditional system on chip (SoC) design process, which has fully qualified verification methods embodied in the form of process design kits (PDKs), chip design companies and outsourced ...
No matter how you get your news, it seems like everyone is talking about AI – and it’s either going to usher in a new era of productivity or lead to the end of humankind itself. Regardless, the AI era ...
Siemens Digital Industries Software, a unit of Siemens AG, on Monday said it launched new software called Tessent Multi-die that automates a design process for testing chips made with advanced ...
Samsung Electronics Co. Ltd. said today it has managed to squeeze an extra four layers onto its current eight-layer High Bandwidth Memory-2 products. High Bandwidth Memory-2 is a kind of memory ...
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