As the semiconductor industry continues its relentless march towards smaller process nodes and more complex integrated circuits (ICs), the challenge of ensuring reliability has become increasingly ...

Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

“You know, brain surgery’s not difficult if you don’t care whether the person dies, it’s actually quite easy. Flying a plane is quite easy if you don’t mind crashing. That’s what hard means. It’s an ...

Hi folk, I’ve been in hunkered down mode for the last few weeks researching and writing my next cover story. This one’s on IC reliability. It’s a subject I haven’t tackled before and quite frankly is ...

MUNICH--(BUSINESS WIRE)--Cadence Design Systems, Inc. (NASDAQ: CDNS) today introduced the Cadence ® Legato™ Reliability Solution, the industry’s first software product that meets the challenges of ...

Performance of InnoSwitch™3-AQ flyback IC demonstrated in new reference designs featuring wide-creepage package The InnoSwitch3-AQ IC, featuring a 1700 V silicon-carbide (SiC) switch, is an ideal ...

Cadence Design Systems has introduced the Legato Reliability Solution, the industry’s first software product that looks to address the challenges associated with designing high-reliability analogue ...

The InnoSwitch3-AQ IC, featuring a 1700 V silicon-carbide (SiC) switch, is an ideal solution for 800 V vehicles, simplifying manufacturing while enhancing overall system performance and reliability.