Fe1766 delivers an unprecedented 160 A in the industry’s smallest IVR footprint, redefining chip-level and system-level power delivery for the AI era “This launch represents a major milestone in ...
Tech Xplore on MSN
Ultra-compact semiconductor could power next-gen AI and 6G chips
A research team, led by Professor Heein Yoon in the Department of Electrical Engineering at UNIST has unveiled an ultra-small ...
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