The fields of microfluidics and additive manufacturing have converged to transform the design and fabrication of microscale devices. Microfluidics, which involves the precise manipulation of minute ...

From elaborate buildings constructed by on-site 3D printers to synthetic fish for testing hydroelectric projects, U.S. national laboratory scientists are exploring the state of the art in additive ...

The AM process begins with a digital design, usually created using computer-aided design (CAD) software, which is then sliced into thin layers. Depending on the specific AM technique, material may be ...

Tyler Bouchard and Tyler Modelski explore the fundamental changes needed to scale industrial artificial intelligence in ...

A new study on post-processing trends in 2026 has just been released: what changes are coming to additive manufacturing?

Prototype parts are 3D printed in the new Advanced and Additive Manufacturing Center of Excellence to trouble shoot the machines at Rock Island Arsenal - Joint Manufacturing and Technology Center, ...

Researchers provide an overview of existing paths to 3-D materials, but the ultimate goal is to create and customize material at the atomic scale. Material would be assembled atom by atom, much like ...

Additive manufacturing of glass materials represents a transformative innovation within materials science, offering a route to fabricating intricately structured, customisable glass components that ...

The system has been developed to support cutting-edge research and rapid prototyping in demanding environments where ...

ABERDEEN PROVING GROUND, Md. -- Advancements in additive manufacturing have fundamentally changed the scope of what we can design and build. Army researchers explore the technology through a program ...

Manufacturing has gone through a series of major evolutions in the past few years. Subtractive processes (drilling, cutting, CNC milling and turning) and standard formative techniques (injecting, ...

Flexible hybrid electronics (FHE) has spawned the development of novel packaging techniques to overcome the application limitations of the rigid boards, high-temperature solders, bulky component ...