For many years, system-in-package (SiP) technology has been a focus for semiconductor packaging to address the ongoing market trend of system integration and size reduction. Today’s increased ...
Heterogeneous integration technology refers to the integration of separately manufactured components into a higher-level assembly, or system in package (SiP), that in the aggregate, provides enhanced ...
In a new review article publication from Opto-Electronic Advances, Yingtao Hu, Di Liang and, Raymond G. Beausoleil from Hewlett Packard Labs discuss advanced III-V-on-silicon photonic integration.
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