SCHMID Group (NASDAQ: SHMD), a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its ...
PulseForge and Applied Novel Devices Collaborate to Showcase Breakthrough in Photonic Debonding for Advanced Power Electronics Packaging. AUSTIN, TEXAS, USA, August ...
MOUNTAIN VIEW, Calif.--(BUSINESS WIRE)--Diamond Quanta today announced Adamantine Thermal™, an engineered-diamond thermal platform designed for integration into advanced packaging workflows and ...
India's first advanced 3D glass chip packaging unit to be set up in Bhubaneswar with Rs 1,943 crore investment, boosting ...
FREUDENSTADT, Germany, Oct. 08, 2025 (GLOBE NEWSWIRE) -- SCHMID Group, a leading global provider of equipment and solutions for the electronics industry, announces a major expansion of its product ...
The company’s rugged, cool-running, industrial-grade 240-W LED driver put the spotlight on its integrated GaN devices and ...
A new technical paper titled “Liquid Metal Fluidic Connection and Floating Die Structure for Ultralow Thermomechanical Stress of SiC Power Electronics Packaging” was published by researchers at ...
CEO Ben Gliklich highlighted record 2024 adjusted EBITDA of $535 million, despite foreign exchange headwinds, and free cash flow reaching $294 million. He emphasized the company's focus on emerging ...
Electronic Vehicles (EVs) have been at the center of attention in recent years. With the automotive industry becoming more aligned with sustainable development goals, the focus has shifted toward EVs ...
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