SINGAPORE, Aug. 29, 2025 /PRNewswire/ -- Today, Pacdora, a fast-growing packaging design platform, is looking ahead and sharing its vision for a fully AI-powered, end-to-end solution for design and ...

Thermal modeling uses heat transfer and fluid dynamics equations to estimate how temperature changes within a system over time. This simulation allows packaging designers to predict how a solution ...

AI packaging tools provider Pacdora is preparing to introduce a comprehensive AI-powered solution for design and marketing to transform the packaging creation process. With more than six million users ...

Unlike the traditional system on chip (SoC) design process, which has fully qualified verification methods embodied in the form of process design kits (PDKs), chip design companies and outsourced ...

For decades, packaging design has been a painstaking process, with designers and brands having to juggle multiple complex tools to complete just a single project. The outcome has often been riddled ...