A new technical paper titled “3D-ICE 4.0: Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems” was published by researchers at EPFL and Universidad Complutense de Madrid.

NEW DELHI: Hyundai Motor India Ltd (HMIL) will initially produce two car models at its Talegaon plant and prepare the facility to make vehicles for export to emerging markets, as the company marks its ...

The best 3D modeling software and apps are loaded with all the tools required to bring creations to life, whether it's creating architectural mock-ups, 3D printing models, animated figures for films ...

Copilot 3D will turn your 2D images into 3D models. The tool is freely available to anyone, though you do need a Microsoft account. Microsoft suggests using an image with a single subject, even ...

CHICAGO (WLS) -- A nearly 100-year-old building recycled and redefined. "Everybody says the greenest building is an old building because we're not tearing it down.," said John Edel, Founder and ...

The film demonstrates the process of sculpting a clay portrait, detailing the importance of armatures, measurements, and techniques used to create a three-dimensional representation. The sculptor ...

Imagine transforming virtual landscapes into lush, verdant paradises with just a few clicks. The realm of 3d plant model has revolutionized digital design, offering a gateway to greener, more ...

Imagine being able to create a detailed 3D sculpture of someone using nothing more than a single photo. Sounds like something out of a sci-fi movie, right? But thanks to advancements in generative AI, ...

A joint research team from Tsinghua University, University of Science and Technology of China, and Microsoft Research has announced a new 3D generation AI model called ' TRELLIS ' that can ...

Leopoly, the studio behind PC VR modeling software Shapelab (2023), has launched a new version built specifically for Quest headsets. Called Shapelab Lite, the polygon-based 3D modeling app is now in ...

A new technical paper titled “MFIT: Multi-Fidelity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures” was published by researchers at University of Wisconsin–Madison, Washington State ...