A new systems design toolset aims to create a unified user experience for board designers while adding cloud connectivity and artificial intelligence (AI) capabilities, which will enable engineers to ...

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a significant shift in system integration strategies. Industry analyses show 3D IC ...

The days of “throwing it over the wall” are over. Heterogeneous integration is ushering in a new era of silicon chip design with collaboration at its core—one that lives or dies on seamless ...

Medical device designers are at the forefront of a technological renaissance. From wearable monitors and implantable sensors to lab-on-a-chip (LoC) diagnostics, today's medical innovations are more ...

In 2001, the Manifesto for Agile Software Development [1] laid the foundation for many modern software development processes. Today, 20 years later, agile methods are in widespread use in numerous ...

To continue reading this content, please enable JavaScript in your browser settings and refresh this page. In design and construction, the days of having a single ...

To achieve EV potential by squeezing more functionality into a given volume, and delivering value at a compelling price point, means there are strong incentives for integrating motor and inverter.

Pulsonix has introduced a direct interface with ADAM Research's TRM software, streamlining thermal simulation for PCB designers. As electronics shrink and power up, TRM's advanced modeling helps ...

In the evolving landscape of cancer treatment, proton therapy stands out as a significant advancement. Once considered prohibitively expensive and limited to specialized centers, technological ...