Science Daily

This tiny power module could change how the world uses energy

As global energy demand surges—driven by AI-hungry data centers, advanced manufacturing, and electrified ...
IEEE

A 3D Structure of Single-Sided Cooling Power Module with Low Thermal Resistance and Low Inductance

Abstract: This paper describes the three-dimensional structure of a single-sided cooling power module that uses a lead frame as a heat conduction path to cool power semiconductor dies on both sides.
The Malaysian Reserve

MicroCloud Hologram Inc. Utilizes FPGA to Accelerate Tensor Network Computing to Achieve Quantum Spin Models

MicroCloud Hologram Inc. (NASDAQ: HOLO), (“HOLO” or the “Company”), a technology service provider, proposed an innovative hardware acceleration technology that converts the quantum tensor network ...
IEEE

Overview of Medium Voltage SiC Power Module Packaging Technologies: Layout, Insulation, and Cooling Structure

Abstract: As materials and fabrication processes advance, the medium voltage (MV) silicon carbide (SiC) power semiconductors featuring exceptional electrothermal properties are emerging in high-power ...