Advanced assemblies have enabled an unprecedented rate of advancement in the data center, especially for neural processing, ...

An End-to-End Thermal-Aware Framework for Early-Phase Design Space Exploration of Microfluidic-Cooled 3DICs” was published by ...

Multi-die integration —in which many chip dies are stacked and integrated in a single package ... technologies into solutions addressing different market segments or needs. 3DIC Compiler is a complete ...

Aug. 25, 2020 -- Synopsys, Inc. (Nasdaq: SNPS) today announced that Synopsys and TSMC have collaborated to deliver certified design flows for advanced packaging solutions using the Synopsys 3DIC ...