At the International Solid State Circuits Conference being held in San Francisco this week, IBM Corp. is announcing what it says is a major step forward in solving the multi-core bottleneck; detailing ...

Chipmakers are beginning to incorporate multiple types and flavors of DRAM in the same advanced package, setting the stage for increasingly distributed memory but significantly more complex designs.

For applications where performance is of primary importance, designers have traditionally chosen SRAM technology over DRAM. Although commodity DRAM offers much higher density and a lower cost per bit, ...

Tezzaron Semiconductor Inc. last week announced a new type of pseudo-static memory technology intended to provide an alternative to embedded SRAM or DRAM in discrete memory ICs and systems-on-chip.

KIRKLAND, Wash., Nov. 07, 2022 (GLOBE NEWSWIRE) -- Alliance Memory today announced its technology lineup for electronica 2022, taking place Nov. 15-18 at the Trade Fair Center in Munich, Germany.

Gamers Nexus video with a bit about it: So on the server side, Intel is going to MCM on the server side... with HBM on the module. 64GB of HBM that can be used as the entirety of the memory (no ...